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MEG-SS8A2
Wafer Spin Scrubber MEG-SS8A2
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Description | Specification |
---|---|
Wafer Size | Φ4~8” (100mm~200mm) Open cassette or SMIF |
Transfer Robot | Multi Transfer Unit IDR 2Arms, MTR 2Arms |
Process Method | PVA Brush Cleaning, Ultra Sonic Cleaning, Jet Nano Spray (MC Spray) E-Flow System (CO2) |
Other | Followed Semi Standard |
OS | MS Windows10 Based, Ether-CAT |
FA | SECSII, GEM Automation |
Max speed | 250WPH |
Process Throughput | Front 4chamber Process Time 56/sec 220WPH Both (2Front, 2Back) Process Time 56/sec 100WPH |